| Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks A Renfer, MK Tiwari, R Tiwari, F Alfieri, T Brunschwiler, B Michel, ... International Journal of Heat and Mass Transfer 65, 33-43, 2013 | 82 | 2013 |
| 3D integrated water cooling of a composite multilayer stack of chips F Alfieri, MK Tiwari, I Zinovik, D Poulikakos, T Brunschwiler, B Michel | 81 | 2010 |
| Computational modeling of vortex shedding in water cooling of 3D integrated electronics F Alfieri, MK Tiwari, A Renfer, T Brunschwiler, B Michel, D Poulikakos International Journal of Heat and Fluid Flow 44, 745-755, 2013 | 37 | 2013 |
| On the significance of developing boundary layers in integrated water cooled 3D chip stacks F Alfieri, MK Tiwari, I Zinovik, T Brunschwiler, B Michel, D Poulikakos International journal of heat and mass transfer 55 (19-20), 5222-5232, 2012 | 23 | 2012 |
| Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics MK Tiwari, S Zimmermann, CS Sharma, F Alfieri, A Renfer, T Brunschwiler, ... 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 22 | 2012 |
| Computational modeling of hot-spot identification and control in 3-D stacked chips with integrated cooling F Alfieri, S Gianini, MK Tiwari, T Brunschwiler, B Michel, D Poulikakos Numerical Heat Transfer, Part A: Applications 65 (3), 201-215, 2014 | 19 | 2014 |
| Numerical modeling of 3D integrated water cooling of electronic chip stacks F Alfieri ETH Zurich, 2013 | | 2013 |
Manish K. TiwariUniversity College LondonVerified email at ucl.ac.uk
