| Symmetrical unit-cell numerical approach for flip-chip underfill flow simulation FC Ng, MH Zawawi, LH Tung, MA Abas, MZ Abdullah CFD Letters 12 (8), 55-63, 2020 | 7 | 2020 |
| Reliability analysis on the reservoir dam spillway structure using fluid-structure interaction MH Zawawi, FC Ng, A Azman, LH Tung, I Abustan, ZMR Rozainy, A Abas IOP Conference Series: Materials Science and Engineering 920 (1), 012030, 2020 | 6 | 2020 |
| Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation FC Ng, LH Tung, MH Zawawi, MAFM Mukhtar, MA Abas, MZ Abdullah CFD Letters 12 (6), 28-38, 2020 | 5 | 2020 |
| Finite Volume Method Numerical Modelling of the Penstock Flows in Dam Intake Sector Subjected to Varying Operating Conditions with Particle Image Velocimetry Validation NM Zahar, MH Zawawi, FC Ng, MA Abas, F Nurhikmah, N Abd Aziz, ... Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 86 (1 …, 2021 | 2 | 2021 |
| Dynamic FSI simulation of pin transfer process for solder paste transport LH Tung, MA Mukhtar, A Abas, A Azman, FC Ng, MN Nashrudin, ... AIP Conference Proceedings 2129 (1), 2019 | 1 | 2019 |
| Recent advance in using eco-friendly carbon-based conductive ink for printed strain sensor: A review NIIM Hairi, AAM Ralib, AN Nordin, MFAM Yunos, LL Ming, LH Tung, ... Cleaner Materials, 100248, 2024 | | 2024 |
| Bond pad connector for securing an electronic component thereon LH Tung, LM Lim, Z Samsudin US Patent App. 18/355,167, 2024 | | 2024 |
| A 3.5 GHz Wearable Antipodal Vivaldi Antenna for 5G Applications S Afroz, AA Al-Hadi, SN Azemi, WF Hoon, S Padmanathan, CMNC Isa, ... 2023 IEEE International Symposium On Antennas And Propagation (ISAP), 1-2, 2023 | | 2023 |
| QUAD FLAT NO-LEAD PACKAGE WITH DIFFERENT THERMAL PROFILES AND SOLDER PAD FINISHING FOR VOID MINIMIZATION MS Mahyuddin, MZ Abdullah, Z Samsudin, I Mansor, LM Lim, MYT Ali, ... Jurnal Teknologi 84 (6-2), 65-75, 2022 | | 2022 |
| Analytical Analysis on the Capillary Pressure of Underfill Flow Meniscus During the Flip-Chip Encapsulation Process FC Ng, LH Tung, MA Abas Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 94 (2 …, 2022 | | 2022 |
| Effect of different temperature distribution on multi-stack BGA package LH Tung, FC Ng, A Abas, MZ Abdullah, Z Samsudin, MY Tura Ali Microelectronics International 38 (2), 33-45, 2021 | | 2021 |
