| High-resolution aliasing-free optical beam steering DN Hutchison, J Sun, JK Doylend, R Kumar, J Heck, W Kim, CT Phare, ... Optica 3 (8), 887-890, 2016 | 516 | 2016 |
| Polycrystalline silicon-germanium films for integrated microsystems AE Franke, JM Heck, TJ King, RT Howe Journal of microelectromechanical systems 12 (2), 160-171, 2003 | 191 | 2003 |
| Hybrid III-V silicon laser formed by direct bonding J Heck, H Bar, R Jones, H Park US Patent 8,620,164, 2013 | 177 | 2013 |
| Demonstration of a high speed 4-channel integrated silicon photonics WDM link with hybrid silicon lasers A Alduino, L Liao, R Jones, M Morse, B Kim, WZ Lo, J Basak, B Koch, ... Integrated Photonics Research, Silicon and Nanophotonics, PDIWI5, 2010 | 171 | 2010 |
| Optical interconnect system integration for ultra-short-reach applications E Mohammed, A Alduino, T Thomas, H Braunisch, D Lu, J Heck, A Liu, ... Intel Technol. J 8 (2), 115-127, 2004 | 161 | 2004 |
| 1.6 Tbps silicon photonics integrated circuit and 800 Gbps photonic engine for switch co-packaging demonstration S Fathololoumi, D Hui, S Jadhav, J Chen, K Nguyen, MN Sakib, Z Li, ... Journal of Lightwave Technology 39 (4), 1155-1161, 2020 | 113 | 2020 |
| Solid state LIDAR circuit with waveguides tunable to separate phase offsets J Heck, JK Doylend, DN Hutchison, H Rong, JB Sendowski US Patent 9,575,341, 2017 | 113 | 2017 |
| Hybrid III–V/Si distributed-feedback laser based on adhesive bonding S Stankovic, R Jones, MN Sysak, JM Heck, G Roelkens, D Van Thourhout IEEE Photonics Technology Letters 24 (23), 2155-2158, 2012 | 112 | 2012 |
| Packaging microelectromechanical structures Q Ma, V Rao, J Heck, D Wong, M Berry US Patent 6,852,926, 2005 | 104 | 2005 |
| Microelectromechanical (MEMS) switching apparatus Q Ma, V Rao, J Heck, LP Wang, D Shim, Q Tran US Patent 6,967,548, 2005 | 98 | 2005 |
| PECVD silicon carbide as a chemically resistant material for micromachined transducers AF Flannery, NJ Mourlas, CW Storment, S Tsai, SH Tan, J Heck, D Monk, ... Sensors and Actuators A: Physical 70 (1-2), 48-55, 1998 | 87 | 1998 |
| Packaging microelectromechanical systems J Heck, M Berry, D Wong, V Rao US Patent App. 10/107,624, 2003 | 84 | 2003 |
| Module integrating MEMS and passive components J Heck, Q Ma, E Bar-Sadeh US Patent 7,183,622, 2007 | 83 | 2007 |
| 1310-nm hybrid III–V/Si Fabry–Pérot laser based on adhesive bonding S Stankovic, R Jones, MN Sysak, JM Heck, G Roelkens, D Van Thourhout IEEE Photonics Technology Letters 23 (23), 1781-1783, 2011 | 82 | 2011 |
| Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator DM Wong, J Heck, V Rao US Patent 6,713,314, 2004 | 82 | 2004 |
| 1.6 Tbps silicon photonics integrated circuit for co-packaged optical-IO switch applications S Fathololoumi, K Nguyen, H Mahalingam, M Sakib, Z Li, C Seibert, ... Optical Fiber Communication Conference, T3H. 1, 2020 | 81 | 2020 |
| Metal contact reliability of RF MEMS switches Q Ma, Q Tran, TKA Chou, J Heck, H Bar, R Kant, V Rao Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI 6463 …, 2007 | 81 | 2007 |
| Packaging microelectromechanical structures Q Ma, V Rao, LP Wang, J Heck, Q Tran US Patent 6,903,452, 2005 | 81 | 2005 |
| Resolution determination in X-ray microscopy: an analysis of the effects of partial coherence and illumination spectrum JM Heck, DT Attwood, W Meyer-Ilse, EH Anderson Journal of X-Ray Science and Technology 8 (2), 95-104, 1998 | 76 | 1998 |
| Low inductance via structures J Heck, Q Ma US Patent App. 11/135,112, 2006 | 75 | 2006 |
Haisheng RongIntelVerified email at intel.com
