Dhruv Bhate
TitleCited byYear
Constitutive behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu alloys at creep and low strain rate regimes
D Bhate, D Chan, G Subbarayan, TC Chiu, V Gupta, DR Edwards
IEEE Transactions on Components and Packaging Technologies 31 (3), 622-633, 2008
982008
Beautiful and functional: a review of biomimetic design in additive manufacturing
A du Plessis, C Broeckhoven, I Yadroitsava, I Yadroitsev, CH Hands, ...
Additive Manufacturing, 2019
262019
Aging-informed behavior of Sn3. 8Ag0. 7Cu solder alloys
K Mysore, D Chan, D Bhate, G Subbarayan, I Dutta, V Gupta, J Zhao, ...
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008
202008
Rate-dependent behavior of Sn3.8Ag0.7Cu solder over strain rates of 10−6to 102s−1
X Nie, D Bhate, D Chan, W Chen, G Subbarayan, I Dutta
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008
132008
Solder interconnection specimen design and test control procedure for vaild constitutive modeling of solder alloys
D Bhate, D Chan, G Subbarayan, TC Chiu
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006
132006
A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints
D Bhate, D Chan, G Subbarayan, L Nguyen
Journal of Electronic Packaging 130 (2), 2008
122008
High strain rate behavior of Sn3. 8Ag0. 7Cu solder alloys and its influence on the fracture location within solder joints
D Chan, X Nie, D Bhate, G Subbarayan, I Dutta
ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat …, 2009
112009
An information theoretic argument on the form of damage accumulation in solids
D Bhate, K Mysore, G Subbarayan
Mechanics of Advanced Materials and Structures 19 (1-3), 184-195, 2012
92012
Fatigue crack growth and life descriptions of Sn3. 8Ag0. 7Cu solder joints: a computational and experimental study
D Bhate, D Chan, G Subbarayan, L Nguyen
2007 Proceedings 57th Electronic Components and Technology Conference, 558-565, 2007
92007
Classification and selection of cellular materials in mechanical design: Engineering and biomimetic approaches
D Bhate, CA Penick, LA Ferry, C Lee
Designs 3 (1), 19, 2019
82019
Constitutive models for intermediate-and high-strain rate flow behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu solder alloys
D Chan, X Nie, D Bhate, G Subbarayan, WW Chen, I Dutta
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (1 …, 2012
82012
Creep and low strain rate behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu alloys: Development of valid constitutive models
D Bhate, D Chan, G Subbarayan, TC Chiu, V Gupta, D Edwards
submitted to IEEE Transactions on Components and Packaging Technologies, 2008
82008
Hierarchy in fracture as a stochastic process: Model, implementation and validation
D Bhate
PURDUE UNIVERSITY (PhD Thesis), 2008
72008
A Framework for the Design of Biomimetic Cellular Materials for Additive Manufacturing
PB McNulty, T., D. Bhate, A. Zhang, M.A. Kiser, L.A, Ferry, A. Suder, S ...
Solid Freeform Fabrication, 2188-2200, 2017
6*2017
DETERMINATION OF A SHAPE AND SIZE INDEPENDENT MATERIAL MODULUS FOR HONEYCOMB STRUCTURES IN ADDITIVE MANUFACTURING
T Le, D Bhate, JM Parsey Jr, KH Hsu
52017
Constitutive and failure behavior of SnAgCu solder alloys
G Subbarayan, D Chan, D Bhate
InterPACK, 2011
52011
A nonlinear fracture mechanics prespective on solder joint failure: going beyond the coffin-manson equation
D Bhate, G Subbarayan
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006
52006
Four questions in cellular material design
D Bhate
Materials 12 (7), 1060, 2019
42019
Integrated circuit package having security feature and method of manufacturing same
DP Bhate, SL Voronov
US Patent 8,076,776, 2011
42011
Adhesion of arbitrary-shaped thin-film microstructures
D Bhate, ML Dunn
Microelectronics Reliability 47 (12), 2014-2024, 2007
42007
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