Dhruv Bhate
Title
Cited by
Cited by
Year
Constitutive behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu alloys at creep and low strain rate regimes
D Bhate, D Chan, G Subbarayan, TC Chiu, V Gupta, DR Edwards
IEEE Transactions on Components and Packaging Technologies 31 (3), 622-633, 2008
1032008
Beautiful and functional: a review of biomimetic design in additive manufacturing
A du Plessis, C Broeckhoven, I Yadroitsava, I Yadroitsev, CH Hands, ...
Additive Manufacturing 27, 408-427, 2019
902019
Classification and selection of cellular materials in mechanical design: Engineering and biomimetic approaches
D Bhate, CA Penick, LA Ferry, C Lee
Designs 3 (1), 19, 2019
232019
Aging-informed behavior of Sn3. 8Ag0. 7Cu solder alloys
K Mysore, D Chan, D Bhate, G Subbarayan, I Dutta, V Gupta, J Zhao, ...
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008
212008
A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints
D Bhate, D Chan, G Subbarayan, L Nguyen
Journal of Electronic Packaging 130 (2), 2008
152008
Four questions in cellular material design
D Bhate
Materials 12 (7), 1060, 2019
132019
Solder interconnection specimen design and test control procedure for vaild constitutive modeling of solder alloys
D Bhate, D Chan, G Subbarayan, TC Chiu
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006
132006
Rate-dependent behavior of Sn3.8Ag0.7Cu solder over strain rates of 10−6to 102s−1
X Nie, D Bhate, D Chan, W Chen, G Subbarayan, I Dutta
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008
122008
High strain rate behavior of Sn3. 8Ag0. 7Cu solder alloys and its influence on the fracture location within solder joints
D Chan, X Nie, D Bhate, G Subbarayan, I Dutta
International Electronic Packaging Technical Conference and Exhibition 43598 …, 2009
112009
An information theoretic argument on the form of damage accumulation in solids
D Bhate, K Mysore, G Subbarayan
Mechanics of Advanced Materials and Structures 19 (1-3), 184-195, 2012
102012
Constitutive models for intermediate-and high-strain rate flow behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu solder alloys
D Chan, X Nie, D Bhate, G Subbarayan, WW Chen, I Dutta
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (1 …, 2012
92012
Fatigue crack growth and life descriptions of Sn3. 8Ag0. 7Cu solder joints: a computational and experimental study
D Bhate, D Chan, G Subbarayan, L Nguyen
Proceedings of the 57th Electronic Components and Technology Conference, 558-565, 2007
92007
A Framework for the Design of Biomimetic Cellular Materials for Additive Manufacturing
PB McNulty, T., D. Bhate, A. Zhang, M.A. Kiser, L.A, Ferry, A. Suder, S ...
Solid Freeform Fabrication, 2188-2200, 2017
8*2017
Creep and Low Strain Rate Behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu Alloys: Development of Valid Constitutive Models
D Bhate, D Chan, G Subbarayan, TC Chiu, V Gupta, D Edwards
submitted to IEEE Transactions on Components and Packaging Technologies, 2008
72008
Hierarchy in fracture as a stochastic process: Model, implementation and validation
D Bhate
PURDUE UNIVERSITY (PhD Thesis), 2008
72008
A nonlinear fracture mechanics prespective on solder joint failure: going beyond the coffin-manson equation
D Bhate, G Subbarayan
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006
72006
DETERMINATION OF A SHAPE AND SIZE INDEPENDENT MATERIAL MODULUS FOR HONEYCOMB STRUCTURES IN ADDITIVE MANUFACTURING
T Le, D Bhate, JM Parsey Jr, KH Hsu
62017
Constitutive and failure behavior of SnAgCu solder alloys
G Subbarayan, D Chan, D Bhate
Purdue University, 2011
52011
Beautiful and functional: a review of biomimetic design in additive manufacturing, Addit. Manuf. 27 (2019) 408–427
A du Plessis, C Broeckhoven, I Yadroitsava, I Yadroitsev, CH Hands, ...
5
Integrated circuit package having security feature and method of manufacturing same
DP Bhate, SL Voronov
US Patent 8,076,776, 2011
42011
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