| Constitutive behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu alloys at creep and low strain rate regimes D Bhate, D Chan, G Subbarayan, TC Chiu, V Gupta, DR Edwards IEEE Transactions on Components and Packaging Technologies 31 (3), 622-633, 2008 | 98 | 2008 |
| Beautiful and functional: a review of biomimetic design in additive manufacturing A du Plessis, C Broeckhoven, I Yadroitsava, I Yadroitsev, CH Hands, ... Additive Manufacturing, 2019 | 26 | 2019 |
| Aging-informed behavior of Sn3. 8Ag0. 7Cu solder alloys K Mysore, D Chan, D Bhate, G Subbarayan, I Dutta, V Gupta, J Zhao, ... 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008 | 20 | 2008 |
| Rate-dependent behavior of Sn3.8Ag0.7Cu solder over strain rates of 10−6to 102s−1 X Nie, D Bhate, D Chan, W Chen, G Subbarayan, I Dutta 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008 | 13 | 2008 |
| Solder interconnection specimen design and test control procedure for vaild constitutive modeling of solder alloys D Bhate, D Chan, G Subbarayan, TC Chiu Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 13 | 2006 |
| A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints D Bhate, D Chan, G Subbarayan, L Nguyen Journal of Electronic Packaging 130 (2), 2008 | 12 | 2008 |
| High strain rate behavior of Sn3. 8Ag0. 7Cu solder alloys and its influence on the fracture location within solder joints D Chan, X Nie, D Bhate, G Subbarayan, I Dutta ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat …, 2009 | 11 | 2009 |
| An information theoretic argument on the form of damage accumulation in solids D Bhate, K Mysore, G Subbarayan Mechanics of Advanced Materials and Structures 19 (1-3), 184-195, 2012 | 9 | 2012 |
| Fatigue crack growth and life descriptions of Sn3. 8Ag0. 7Cu solder joints: a computational and experimental study D Bhate, D Chan, G Subbarayan, L Nguyen 2007 Proceedings 57th Electronic Components and Technology Conference, 558-565, 2007 | 9 | 2007 |
| Classification and selection of cellular materials in mechanical design: Engineering and biomimetic approaches D Bhate, CA Penick, LA Ferry, C Lee Designs 3 (1), 19, 2019 | 8 | 2019 |
| Constitutive models for intermediate-and high-strain rate flow behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu solder alloys D Chan, X Nie, D Bhate, G Subbarayan, WW Chen, I Dutta IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (1 …, 2012 | 8 | 2012 |
| Creep and low strain rate behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu alloys: Development of valid constitutive models D Bhate, D Chan, G Subbarayan, TC Chiu, V Gupta, D Edwards submitted to IEEE Transactions on Components and Packaging Technologies, 2008 | 8 | 2008 |
| Hierarchy in fracture as a stochastic process: Model, implementation and validation D Bhate PURDUE UNIVERSITY (PhD Thesis), 2008 | 7 | 2008 |
| A Framework for the Design of Biomimetic Cellular Materials for Additive Manufacturing PB McNulty, T., D. Bhate, A. Zhang, M.A. Kiser, L.A, Ferry, A. Suder, S ... Solid Freeform Fabrication, 2188-2200, 2017 | 6* | 2017 |
| DETERMINATION OF A SHAPE AND SIZE INDEPENDENT MATERIAL MODULUS FOR HONEYCOMB STRUCTURES IN ADDITIVE MANUFACTURING T Le, D Bhate, JM Parsey Jr, KH Hsu | 5 | 2017 |
| Constitutive and failure behavior of SnAgCu solder alloys G Subbarayan, D Chan, D Bhate InterPACK, 2011 | 5 | 2011 |
| A nonlinear fracture mechanics prespective on solder joint failure: going beyond the coffin-manson equation D Bhate, G Subbarayan Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 5 | 2006 |
| Four questions in cellular material design D Bhate Materials 12 (7), 1060, 2019 | 4 | 2019 |
| Integrated circuit package having security feature and method of manufacturing same DP Bhate, SL Voronov US Patent 8,076,776, 2011 | 4 | 2011 |
| Adhesion of arbitrary-shaped thin-film microstructures D Bhate, ML Dunn Microelectronics Reliability 47 (12), 2014-2024, 2007 | 4 | 2007 |
Ganesh SubbarayanProfessor of Mechanical Engineering, Purdue UniversityVerified email at purdue.edu
