| Microprocessor assembly adapted for fluid cooling TA Shedd, BA Lindeman, RA Buchanan US Patent 9,852,963, 2017 | 52 | 2017 |
| Multi-chamber heat sink module TA Shedd, BA Lindeman, RA Buchanan, MA Rodarte US Patent App. 14/880,225, 2017 | 52 | 2017 |
| Two-phase cooling system TA Shedd, BA Lindeman, RA Buchanan US Patent App. 14/924,674, 2016 | 42 | 2016 |
| Extensive parametric study of heat transfer to arrays of oblique impinging jets with phase change RA Buchanan, TA Shedd Journal of heat transfer 135 (11), 111017, 2013 | 27 | 2013 |
| Circuit board assembly adapted for fluid cooling TA Shedd, BA Lindeman, RA Buchanan US Patent App. 14/876,575, 2016 | 24 | 2016 |
| Two-Phase Jet Impingement RA Buchanan University of Wisconsin-Madison, 2012 | 15* | 2012 |
| Server with cooling line assembly TA Shedd, BA Lindeman, RA Buchanan US Patent App. 14/859,299, 2016 | 14 | 2016 |
| Flexible cooling line assembly TA Shedd, BA Lindeman, RA Buchanan US Patent App. 14/853,927, 2016 | 11 | 2016 |
| Multi-chamber heat sink module RA Buchanan US Patent App. 29/539,319, 2018 | 5 | 2018 |
| Mounting bracket for heat sink module BA Lindeman, RA Buchanan US Patent App. 29/529,999, 2018 | 1 | 2018 |
| Flexible cooling line assembly T SHEDD, B LINDEMAN, R BUCHANAN | | 2016 |
Timothy SheddThermal Strategy, Office of the CTO, Dell TechnologiesVerified email at dell.com
Timothy SheddThermal Strategy, Office of the CTO, Dell TechnologiesVerified email at dell.com