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- Linshuang LongUniversity of Science and Technology of ChinaVerified email at ustc.edu.cn
- Saichao DangUniversity of Science and Technology of ChinaVerified email at mail.ustc.edu.cn
- Yanfeng Gaoshanghai universityVerified email at shu.edu.cn
- Qing NiUniversity of Science and Technology of ChinaVerified email at ustc.edu.cn
- Ruqiang ZOUPeking UniversityVerified email at pku.edu.cn
- Xiaojia WangAssociate professor of Mechanical Engineering, U of MVerified email at umn.edu
- Liping WangAssociate Professor of Mechanical Engineering, Arizona State UniversityVerified email at asu.edu
- Yue YangAssociate Professor, Energy and Power Engineering, Harbin Institute of Technology (Shenzhen)Verified email at hit.edu.cn
- zijun wangUniversity of Science and Technology of ChinaVerified email at mail.ustc.edu.cn
- Litao KangTaiyuan university of technologyVerified email at tyut.edu.cn
- Wei Lingeorgia institute of technology, IBM@Albany Nanotech; present: Apple Inc. HW R&DVerified email at apple.com
- Jiu XuMeta, Hardware EngineeringVerified email at meta.com
- Martha Lux-SteinerVerified email at helmholtz-berlin.de
- Zhuomin ZhangProfessor of Mechanical Engineering, Georgia Institute of TechnologyVerified email at me.gatech.edu
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Hong Ye
Professor of School of Engineering Science, University of Science and Technology of China
Verified email at ustc.edu.cn - Homepage