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Jeffrey Davis
Jeffrey Davis
Associate Professor of Electrical and Computer Engineering, Georgia Institute of Technology
Verified email at ece.gatech.edu
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Year
Interconnect limits on gigascale integration (GSI) in the 21st century
JA Davis, R Venkatesan, A Kaloyeros, M Beylansky, SJ Souri, K Banerjee, ...
Proceedings of the IEEE 89 (3), 305-324, 2001
8262001
A stochastic wire-length distribution for gigascale integration (GSI). I. Derivation and validation
JA Davis, VK De, JD Meindl
IEEE Transactions on Electron Devices 45 (3), 580-589, 1998
505*1998
Limits on silicon nanoelectronics for terascale integration
JD Meindl, Q Chen, JA Davis
Science 293 (5537), 2044-2049, 2001
5022001
Interconnect opportunities for gigascale integration
JD Meindl, JA Davis, P Zarkesh-Ha, CS Patel, KP Martin, PA Kohl
IBM journal of research and development 46 (2.3), 245-263, 2002
2292002
Compact distributed RLC interconnect models. I. Single line transient, time delay, and overshoot expressions
JA Davis, JD Meindl
IEEE Transactions on Electron Devices 47 (11), 2068-2077, 2000
2082000
The fundamental limit on binary switching energy for terascale integration (TSI)
JD Meindl, JA Davis
IEEE Journal of Solid-State Circuits 35 (10), 1515-1516, 2000
1972000
Compact distributed RLC interconnect models-Part II: Coupled line transient expressions and peak crosstalk in multilevel networks
JA Davis, JD Meindl
IEEE Transactions on Electron Devices 47 (11), 2078-2087, 2000
1792000
Compact distributed RLC interconnect models-part IV: unified models for time delay, crosstalk, and repeater insertion
R Venkatesan, JA Davis, JD Meindl
IEEE Transactions on Electron Devices 50 (4), 1094-1102, 2003
1172003
Impact of three-dimensional architectures on interconnects in gigascale integration
JW Joyner, R Venkatesan, P Zarkesh-Ha, JA Davis, JD Meindl
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 9 (6), 922-928, 2001
1062001
Interconnect technology and design for gigascale integration
JA Davis, JD Meindl
Springer Science & Business Media, 2012
992012
Optimal n-tier multilevel interconnect architectures for gigascale integration (GSI)
R Venkatesan, JA Davis, KA Bowman, JD Meindl
IEEE transactions on very large scale integration (VLSI) systems 9 (6), 899-912, 2001
852001
Prediction of net-length distribution for global interconnects in a heterogeneous system-on-a-chip
P Zarkesh-Ha, JA Davis, JD Meindl
IEEE transactions on very large scale integration (VLSI) systems 8 (6), 649-659, 2000
792000
Compact distributed RLC interconnect models-Part III: Transients in single and coupled lines with capacitive load termination
R Venkatesan, JA Davis, JD Meindl
IEEE transactions on Electron Devices 50 (4), 1081-1093, 2003
662003
A three-dimensional stochastic wire-length distribution for variable separation of strata
JW Joyner, P Zarkesh-Ha, JA Davis, JD Meindl
Proceedings of the IEEE 2000 International Interconnect Technology …, 2000
652000
Interconnecting device opportunities for gigascale integration (GSI)
JD Meindl, R Venkatesan, JA Davis, J Joyner, A Naeemi, P Zarkesh-Ha, ...
International Electron Devices Meeting. Technical Digest (Cat. No. 01CH37224 …, 2001
572001
Optimization of throughput performance for low-power VLSI interconnects
VV Deodhar, JA Davis
IEEE transactions on very large scale integration (VLSI) systems 13 (3), 308-318, 2005
522005
IntSim: A CAD tool for optimization of multilevel interconnect networks
DC Sekar, A Naeemi, R Sarvari, JA Davis, JD Meindl
2007 IEEE/ACM International Conference on Computer-Aided Design, 560-567, 2007
512007
A compact physical via blockage model
Q Chen, JA Davis, P Zarkesh-Ha, JD Meindl
IEEE transactions on very large scale integration (VLSI) systems 8 (6), 689-692, 2000
502000
Prediction of interconnect fan-out distribution using Rent's rule
P Zarkesh-Ha, JA Davis, W Loh, JD Meindl
Proceedings of the 2000 international workshop on System-level interconnect …, 2000
482000
Materials Processing and Packgaging-Compact Distributed RLC Interconnect Models--Part I: Single Line Transient, Time Delay, and Overshoot Expressions
JA Davis, JD Meindl
IEEE Transactions on Electron Devices 47 (11), 2068-2077, 2000
422000
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