| Six cases of reliability study of Pb-free solder joints in electronic packaging technology K Zeng, KN Tu Materials science and engineering: R: reports 38 (2), 55-105, 2002 | 1564 | 2002 |
| Tin–lead (SnPb) solder reaction in flip chip technology KN Tu, K Zeng Materials science and engineering: R: reports 34 (1), 1-58, 2001 | 783 | 2001 |
| Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability K Zeng, R Stierman, TC Chiu, D Edwards, K Ano, KN Tu Journal of applied physics 97 (2), 2005 | 525 | 2005 |
| Effect of thermal aging on board level drop reliability for Pb-free BGA packages TC Chiu, K Zeng, R Stierman, D Edwards, K Ano 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 364 | 2004 |
| Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5 Ag, Sn–3.8 Ag–0.7 Cu and Sn–0.7 Cu) on Cu TY Lee, WJ Choi, KN Tu, JW Jang, SM Kuo, JK Lin, DR Frear, K Zeng, ... Journal of Materials Research 17 (2), 291-301, 2002 | 317 | 2002 |
| Critical assessment and thermodynamic modeling of the Mg–H system K Zeng, T Klassen, W Oelerich, R Bormann International journal of hydrogen energy 24 (10), 989-1004, 1999 | 183 | 1999 |
| Thermodynamic Modelling of Solutions and Alloys I Ansara, TG Chart, AF Guillermet, FH Hayes, UR Kattner, DG Pettifor, ... Calphad 21 (2), 171-218, 1997 | 175* | 1997 |
| Wetting reaction versus solid state aging of eutectic SnPb on Cu KN Tu, TY Lee, JW Jang, L Li, DR Frear, K Zeng, JK Kivilahti Journal of applied physics 89 (9), 4843-4849, 2001 | 168 | 2001 |
| A new thermodynamic description of the Cu-Zr system KJ Zeng, M Hämäläinen, HL Lukas Journal of phase equilibria 15, 577-586, 1994 | 133 | 1994 |
| Interfacial reactions between lead-free SnAgCu solder and Ni (P) surface finish on printed circuit boards K Zeng, V Vuorinen, JK Kivilahti IEEE Transactions on Electronics Packaging Manufacturing 25 (3), 162-167, 2002 | 128 | 2002 |
| Root cause of black pad failure of solder joints with electroless nickel/immersion gold plating K Zeng, R Stierman, D Abbott, M Murtuza Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 124 | 2006 |
| Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni (V)/Cu thin films M Li, F Zhang, WT Chen, K Zeng, KN Tu, H Balkan, P Elenius Journal of materials research 17 (7), 1612-1621, 2002 | 110 | 2002 |
| Failure mechanism of Ta diffusion barrier between Cu and Si T Laurila, K Zeng, JK Kivilahti, J Molarius, I Suni Journal of Applied Physics 88 (6), 3377-3384, 2000 | 110 | 2000 |
| The ternary system Al–Ni–Ti Part I: Isothermal section at 900° C; Experimental investigation and thermodynamic calculation B Huneau, P Rogl, K Zeng, R Schmid-Fetzer, M Bohn, J Bauer Intermetallics 7 (12), 1337-1345, 1999 | 103 | 1999 |
| Phase relationships in Cu-rich corner of the Cu-Cr-Zr phase diagram KJ Zeng, M Hämäläinen, K Lilius Scripta Metallurgica et Materialia 32 (12), 1995 | 101 | 1995 |
| Thermodynamic analysis of the hydriding process of Mg–Ni alloys K Zeng, T Klassen, W Oelerich, R Bormann Journal of Alloys and Compounds 283 (1-2), 213-224, 1999 | 97 | 1999 |
| Tantalum carbide and nitride diffusion barriers for Cu metallisation T Laurila, K Zeng, JK Kivilahti, J Molarius, T Riekkinen, I Suni Microelectronic Engineering 60 (1-2), 71-80, 2002 | 86 | 2002 |
| A theoretical study of the phase equilibria in the Cu Cr Zr system KJ Zeng, M Hämäläinen Journal of Alloys and Compounds 220 (1-2), 53-61, 1995 | 85 | 1995 |
| The ternary system Al–Ni–Ti Part II: Thermodynamic assessment and experimental investigation of polythermal phase equilibria K Zeng, R Schmid-Fetzer, B Huneau, P Rogl, J Bauer intermetallics 7 (12), 1347-1359, 1999 | 83 | 1999 |
| Chemical stability of Ta diffusion barrier between Cu and Si T Laurila, K Zeng, JK Kivilahti, J Molarius, I Suni Thin Solid Films 373 (1-2), 64-67, 2000 | 77 | 2000 |
