| 1.6 Tbps silicon photonics integrated circuit and 800 Gbps photonic engine for switch co-packaging demonstration S Fathololoumi, D Hui, S Jadhav, J Chen, K Nguyen, MN Sakib, Z Li, ... Journal of Lightwave Technology 39 (4), 1155-1161, 2020 | 114 | 2020 |
| 1.6 Tbps silicon photonics integrated circuit for co-packaged optical-IO switch applications S Fathololoumi, K Nguyen, H Mahalingam, M Sakib, Z Li, C Seibert, ... Optical Fiber Communication Conference, T3H. 1, 2020 | 81 | 2020 |
| Sol-gel-based integrated optical microring resonator humidity sensor B Bhola, P Nosovitskiy, H Mahalingam, WH Steier IEEE Sensors Journal 9 (7), 740-747, 2009 | 60 | 2009 |
| 800 Gbps fully integrated silicon photonics transmitter for data center applications H Yu, D Patel, W Liu, Y Malinge, P Doussiere, W Lin, S Gupta, ... Optical Fiber Communication Conference, M2D. 7, 2022 | 56 | 2022 |
| First 400G 8-channel CWDM silicon photonic integrated transmitter JB Driscoll, P Doussiere, S Islam, R Narayan, W Lin, H Mahalingam, ... 2018 IEEE 15th International Conference on Group IV Photonics (GFP), 1-2, 2018 | 30 | 2018 |
| Polymer waveguide couplers for fluorite microresonators AA Savchenkov, H Mahalingam, VS Ilchenko, S Takahashi, AB Matsko, ... IEEE Photonics Technology Letters 29 (8), 667-670, 2017 | 15 | 2017 |
| Silicon photonics for next-generation optical connectivity L Liao, S Fathololoumi, K Nguyen, H Mahalingam, D Hui, J Heck, H Frish, ... 2023 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2023 | 4 | 2023 |
| Characterisation of high‐frequency modulator response via measurements of optical modulation sidebands W Ng, R Sarkissian, H Mahalingam IET Optoelectronics 10 (4), 148-155, 2016 | 3 | 2016 |
| Recent progress toward a nanoslot modulator: polymer poling experiments YS Lee, S Takahashi, H Mahalingam, WH Steier, GE Betts, JX Chen RF and Millimeter-Wave Photonics 7936, 29-34, 2011 | 3 | 2011 |
| Silicon photonic integrated circuit for co-packaging with switch ASIC S Fathololoumi, D Hui, S Jadhav, K Nguyen, MN Sakib, Z Li, ... Silicon Photonics XVI 11691, 25-30, 2021 | 2 | 2021 |
| Photonic integrated circuit packaging architectures KK Darmawikarta, BT Duong, SV Pietambaram, TA Ibrahim, O Ala, B Nie, ... US Patent App. 17/552,169, 2023 | 1 | 2023 |
| Die first fan-out architecture for electric and optical integration B Nie, P Tadayon, LR Arana, Y Li, C Liu, K Darmawikarta, ... US Patent App. 17/481,027, 2023 | 1 | 2023 |
| Advancements in heterogeneously integrated silicon photonics for IMDD and coherent data transmission Y Akulova, R Jones, K Nguyen, R Venables, P Doussiere, A Liu, G Gilardi, ... Optical Fiber Communication Conference, Tu2E. 4, 2023 | 1 | 2023 |
| Packaging solutions for high bandwidth networking applications S Jadhav, J Dominguez, A Agrawal, K Brown, Y Li, J Chen, A Mallik, ... US Patent App. 17/191,615, 2021 | 1 | 2021 |
| Scalable heterogeneously integrated silicon photonics technology platform and its applications Y Akulova, R Jones, R Venables, P Doussiere, M Satter, S Fathololoumi, ... Silicon Photonics XIX 12891, 1289102, 2024 | | 2024 |
| Fully integrated tunable III-V/Si laser with on-chip SOA R Kumar, GL Su, D Huang, CY Soon, M Okitsu, J Davis, T Pham, ... Journal of Lightwave Technology, 2024 | | 2024 |
| Technologies for signal amplification for a photonic integrated circuit H Tanaka, B Nie, K Darmawikarta, H Mahalingam US Patent App. 17/733,302, 2023 | | 2023 |
| Technologies for a beam expansion and collimation for photonic integrated circuits JM Heck, H Rong, H Frish, A Agrawal, B Xie, RS Appleton, H Mahalingam, ... US Patent App. 17/561,694, 2023 | | 2023 |
| Die last and waveguide last architecture for silicon photonic packaging B Nie, P Tadayon, LR Arana, Y Li, C Liu, K Darmawikarta, ... US Patent App. 17/483,013, 2023 | | 2023 |
| Photonic interconnect and components in glass K Darmawikarta, B Duong, SV Pietambaram, TA Ibrahim, H Mahalingam, ... US Patent App. 17/476,357, 2023 | | 2023 |
