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Fei Chong Ng
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Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings
FC Ng, A Abas, ZL Gan, MZ Abdullah, FC Ani, MYT Ali
Microelectronics Reliability 72, 45-64, 2017
362017
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches
FC Ng, A Abas, MZ Abdullah
Microelectronics Reliability 81, 41-63, 2018
342018
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array
FC Ng, A Abas, MHH Ishak, MZ Abdullah, A Aziz
Microelectronics Reliability 66, 143-160, 2016
332016
Numerical study of composite fiberglass cross arms under statics loading and improvement with sleeve installation
D Mohamad, A Syamsir, S Beddu, A Abas, FC Ng, MF Razali, S Seman
IOP Conference Series: Materials Science and Engineering 530 (1), 012027, 2019
232019
Underfill flow in flip-chip encapsulation process: a review
FC Ng, MA Abas
Journal of Electronic Packaging 144 (1), 010803, 2022
222022
Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation
FC Ng, A Abas, MZ Abdullah
Journal of Electronic Packaging 141 (4), 2019
212019
Effect of laminate properties on the failure of cross arm structure under multi-axial load
D Mohamad, A Syamsir, S Beddu, NLM Kamal, MM Zainoodin, MF Razali, ...
IOP Conference Series: Materials Science and Engineering 530 (1), 012029, 2019
212019
Effect of scale size, orientation type and dispensing method on void formation in the CUF encapsulation of BGA
A Abas, FC Ng, ZL Gan, MHH Ishak, MZ Abdullah, GY Chong
Sādhanā 43, 1-14, 2018
212018
CUF scaling effect on contact angle and threshold pressure
FC Ng, MA Abas, MZ Abdullah, MHH Ishak, GY Chong
Soldering & Surface Mount Technology 29 (4), 173-190, 2017
212017
Numerical simulation on the statics deformation study of composite cross arms of different materials and configurations
D Mohamad, A Syamsir, Z Itam, HA Bakar, A Abas, FC Ng, MF Razali, ...
IOP Conference Series: Materials Science and Engineering 530 (1), 012028, 2019
202019
Stacking sequence effects on performance of composite laminate structure subjected to multi-axial quasi-static loading
D Mohamad, A Syamsir, SN Sa’Don, NM Zahari, S Seman, MF Razali, ...
IOP Conference Series: Materials Science and Engineering 530 (1), 012030, 2019
182019
Fluid/structure interaction study on the variation of radial gate’s gap height in dam
FC Ng, A Abas, I Abustan, ZMR Rozainy, MZ Abdullah, SM Kon
IOP Conference Series: Materials Science and Engineering 370 (1), 012063, 2018
182018
Filling efficiency of flip-chip underfill encapsulation process
FC Ng, MA Abas, MZ Abdullah
Soldering & Surface Mount Technology 32 (1), 10-18, 2019
172019
Spatial analysis of underfill flow in flip-chip encapsulation
FC Ng, MH Zawawi, MA Abas
Soldering & Surface Mount Technology 33 (2), 112-127, 2020
162020
Effect of barrier height on the design of stepped spillway using smoothed particle hydrodynamics and particle image velocimetry
A Azman, FC Ng, MH Zawawi, A Abas, MR Rozainy MAZ, I Abustan, ...
KSCE Journal of Civil Engineering 24, 451-470, 2020
142020
A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process
FC Ng, MYT Ali, A Abas, CY Khor, Z Samsudin, MZ Abdullah
The International Journal of Advanced Manufacturing Technology 105, 3521-3530, 2019
142019
Effect of the gap height of radial gate on the volumetric flow rate in dam
FC Ng, A Abas, I Abustan, ZMR Rozainy, MZ Abdullah, SM Kon
IOP Conference Series: Materials Science and Engineering 370 (1), 012062, 2018
102018
Finite volume method study on contact line jump phenomena and dynamic contact angle of underfill flow in flip-chip of various bump pitches
FC Ng, A Abas, MZ Abdullah
IOP Conference Series: Materials Science and Engineering 530 (1), 012012, 2019
92019
Numerical visualization of flow in spillway and downstream of dam using fluid/structure interaction
MN Nashurdin, A Abas, A Azman, FC Ng, MRM Radzi, A Hassani
AIP Conference Proceedings 2129 (1), 020044, 2019
82019
Symmetrical Unit-Cell Numerical Approach for Flip-Chip Underfill Flow Simulation
FC Ng, MH Zawawi, LH Tung, MA Abas, M Zulkifly
CFD Letters 12 (8), 55-63, 2020
72020
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Articles 1–20